EXPRESS CPU module - 企業ランキング(全5社)
更新日: 集計期間:Sep 09, 2026〜Oct 06, 2026
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企業情報を表示
| 会社名 | 代表製品 | ||
|---|---|---|---|
| 製品画像・製品名・価格帯 | 概要 | 用途/実績例 | |
| Specifications Core System: AMD Embedded Ryzen V3000 Memory: Up to 64GB (2x 32GB) DDR5 SO-DIMM, up to 4800MT/s Embedded BIOS: AMI UEFI... | Factory and building automation / multimedia systems / digital signage, etc. | ||
| Specifications ■CPU AMD RX-421BD/RX-418GD/RX-216GD/RX-416GD AMD GX-217GI/GX-224IJ/GX-215IJ ■Memory 2xDDR4-2133 ECC Maximum 64GB ... | Factory and building automation / control systems / communication systems / monitoring systems | ||
| Specifications ■Core System: Intel Atom x7000RE Processor (up to 8 cores, TDP 6–12W) ■Memory: Supports up to 32GB LPDDR5 onboard memory ... | Factory and building automation / multimedia systems / digital signage, etc. | ||
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- 代表製品
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Ryzen COM Express CPU Module Type 7
- 概要
- Specifications Core System: AMD Embedded Ryzen V3000 Memory: Up to 64GB (2x 32GB) DDR5 SO-DIMM, up to 4800MT/s Embedded BIOS: AMI UEFI...
- 用途/実績例
- Factory and building automation / multimedia systems / digital signage, etc.
SECO COM Express CPU Module AMOS
- 概要
- Specifications ■CPU AMD RX-421BD/RX-418GD/RX-216GD/RX-416GD AMD GX-217GI/GX-224IJ/GX-215IJ ■Memory 2xDDR4-2133 ECC Maximum 64GB ...
- 用途/実績例
- Factory and building automation / control systems / communication systems / monitoring systems
COM Express CPU Module TYPE10
- 概要
- Specifications ■Core System: Intel Atom x7000RE Processor (up to 8 cores, TDP 6–12W) ■Memory: Supports up to 32GB LPDDR5 onboard memory ...
- 用途/実績例
- Factory and building automation / multimedia systems / digital signage, etc.
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